• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Materials science amp; technology 2011 conference amp; exhibition >Characterization of low temperature bonding with Cu nanoparticles for electronic packaging applicati on
【24h】

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging applicati on

机译：电子封装应用中与铜纳米粒子的低温键合特性

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Tin-lead alloys are widely used as solder in the electronics industry. For concerns ofrnenvironment and human health, it is necessary to develop new bonding method using Pb-freernmaterial for microelectronic packaging. There have been some reports about low temperaturernbonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles havernsome advantages, such as low cost and good ionic migration property. In this study we reportrna low temperature bonding process using Cu nanoparticles. The polymer coated on thernsurface of Cu nanoparticles can protect them from oxidation. Strong joints were formed atrnbonding temperatures as low as 180℃ under 5MPa in air atmosphere. This novelrnsintering-bonding technology using Cu nanoparticles as interconnection material has arnpotential application for electronic packaging.
机译：锡铅合金在电子工业中被广泛用作焊料。出于对环境和人类健康的关注，有必要开发使用无铅材料的微电子封装的新结合方法。已经有一些关于使用Ag纳米粒子进行低温键合的报道。与Ag纳米颗粒相比，Cu纳米颗粒具有成本低，离子迁移性能好等优点。在这项研究中，我们报告了使用铜纳米颗粒的低温粘结过程。包覆在铜纳米颗粒表面的聚合物可以保护它们免受氧化。在5MPa的大气气氛中，粘结温度低至180℃时形成了牢固的接头。这种使用铜纳米颗粒作为互连材料的新型烧结键合技术在电子包装中具有潜在的应用前景。

著录项

  • 来源
  • 会议地点 Columbus OH(US)
  • 作者

    Jianfeng YAN; Guisheng ZOU; Xiaoyu Wang; Fengwen MU; Hailin BAI; Aiping WU; Anming HU; Y.Norman ZHOU;

  • 作者单位

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical Engineering, Tsinghua University Key Laboratory forAdvanced Manufacturing by Materials Processing Technology, Ministry of Education ofP.R.China;

    Beijing, China;

    Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo,Ontario, Canada;

    Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo,Ontario, Canada;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cu nanoparticles; Sintering; Bonding; Electronic packaging;

    机译：铜纳米粒子;;烧结;;键合;;电子包装;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号