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Development of wide bandgap semiconductor photonic device structures by exciment laser micromachining

机译:宽带隙半导体光子器件结构的研制通过灭活激光微机械

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Excimer laeer ablation rates of So(111) and AlN films grown on Si (111) and r-plane sapphire substrates were determined. Linear dependence of ablation rate of Si (111) substrate, sapphire and AlN thin films were observed. Exciemer laser micromachining of the AlN thin films on silionc (111) and SiC substrates were micromachined to fabricate a waveguide structure and a pixilated structure. This technique resulted in clean precise machining of AlN with high aspect ratios and straight walls.
机译:确定了SO(111)和在Si(111)和R面蓝宝石衬底上生长的所以(111)和ALN薄膜的准分子莱切杀菌速率。观察到Si(111)衬底,蓝宝石和ALN薄膜的烧蚀率的线性依赖性。 SilionC(111)和SiC基板上的ALN薄膜激光微机械线被微加工以制造波导结构和像素化结构。该技术导致ALN的清洁精确加工,具有高纵横比和直壁。

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