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Characterization of stencil printing parameters for fine pitch wafer bumping

机译：细间距晶圆隆起的模版印刷参数的表征

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摘要

Wafer bumping is a key process for flip chip packaging. There are several bumping techniques such as ball drop, electroplating and stencil printing, in which stencil printing is thought to be an economical choice because it is compatible with conventional SMT technology. However, when bump pitch is less than 100 μm, it becomes more difficult to control the deposition volume of the solder paste. In this paper, multiple printing parameters had been characterized by orthogonal experiment method to find the optimal setting for a 4” wafer with 90μm bump pitch. These parameters include printing pressure, printing speed, separation speed, separation distance and printing gap. Transfer ratio of the solder paste was calculated and effects of the printing parameters were analyzed. Results showed transfer ratio increased when reducing printing pressure or increasing printing speed, and printing pressure had the most significant effect over other parameters. Defects like bump bridge and missing ball were also measured to evaluate the printing quality. According to the printing results, proper ranges of the parameters were found. Bumps were reflowed after printed with the optimal parameter setting, and then bumped chips were assembled using flip chip bonder and SEM observation showed good bonding interface.
机译：晶圆隆起是倒装芯片封装的关键过程。有几种凹凸技术，例如落球，电镀和模版印刷，其中模版印刷被认为是一种经济的选择，因为它与传统的SMT技术兼容。然而，当凸块间距小于100μm时，变得难以控制焊膏的沉积量。本文通过正交实验方法对多种印刷参数进行了表征，以找到凸点间距为90μm的4英寸晶圆的最佳设置。这些参数包括印刷压力，印刷速度，分离速度，分离距离和印刷间隙。计算锡膏的转移率，并分析印刷参数的影响。结果表明，当降低打印压力或提高打印速度时，转印率会增加，并且打印压力对其他参数的影响最大。还测量了凹凸桥和缺球等缺陷，以评估打印质量。根据打印结果，找到合适的参数范围。使用最佳参数设置打印后，凸块会回流，然后使用倒装芯片键合机组装凸点芯片，并且SEM观察显示良好的键合界面。

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