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Enhanced stitch bonding concept for QFN package's Cu wirebonding process

机译：QFN封装的铜引线键合工艺的增强针脚键合概念

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For a products such as QFN base package using a leadframe with Palladium (Pd) pre-plated finish (PPF) is a challenge for the Cu wire bonding. Bondability of Cu wire to PPF leadframe have some constraint with the conventional bonding parameters widely used in Au wire bonding process such as Power, Force and Time. It thus result to a frequent alarm of shortail or even NSOL (non-stick on lead) affecting the Yield and its overall manufacturability performance. Typical bonding concept defined in Au wirebonding process is a “thermosonic” bonding or a Power dominant approach that doesn't work well in Cu wire bonding. It's been a nature of Copper wire material which is harder than Au at Vickers hardness of 0.369 versus the Au Vickers hardness of only 0.216. Despite for these challenges, it does not limit to further explore on what is the best combination and suitable process parameter can be use in a PPF base leadframe. A careful understanding and thorough characterization of material and process parameters has been studied to avoid the overbond issue that may impact the process or eventually affect the package reliability. On this paper, it discuss mainly on how to achieve a better stitch bondability through a different approach and parameter concept on QFN (quad flat no-leads) package as the lead vehicle. With the use of Cu wire, basic application of Power, Force & Time resulted to an inconsistent process response due to frequent shortail alarms and NSOL. Second bond stitch visual characteristics observed a “fish tail” like formation with weak or low wirepeel strength. A different approach on the parameter combination has been studied intended with a very low Power or even no Power application combined with a non typical parameter such as the Scrub. The scrub parameter serves as replacement for the Power that delivers weld contact between the Cu wires to leadframe bond finger surface. Pre-installed machine software has a feature tha- able to create a segmented scrub application was utilized as well. Validations were made with a significant improvement in terms of the stitch bondability response and formation. It also addresses to minimize the capillary tip build up that helps to prolong the capillary life which is favorable also for the cost.
机译：对于诸如QFN基本封装之类的产品，使用带有钯（Pd）预镀表面处理（PPF）的引线框架，对铜引线键合来说是一个挑战。铜线与PPF引线框的可焊性受到功率，力和时间等在金线接合工艺中广泛使用的常规接合参数的限制。因此，这会导致频繁出现短时报警，甚至会影响到成品率及其整体可制造性性能的NSOL（不粘铅）。金线键合工艺中定义的典型键合概念是“热电”键合或功率主导方法，在铜线键合中效果不佳。这是铜线材料的本性，在0.369的维氏硬度与仅0.216的金维氏硬度下，比Au硬。尽管面临这些挑战，但并没有限制进一步探索什么是最佳组合，并且可以在PPF基础引线框架中使用合适的工艺参数。已经对材料和工艺参数进行了仔细的理解和全面表征，以避免产生可能影响工艺或最终影响封装可靠性的过度粘结问题。在本文中，它主要讨论如何在QFN（四方扁平无引线）封装作为引线工具的情况下通过不同的方法和参数概念来实现更好的线迹粘合性。使用铜线时，由于频繁的短时报警和NSOL，功率，力和时间的基本应用导致过程响应不一致。二次粘合针迹的视觉特征观察到“鱼尾”状，其弱或低的钢丝剥离强度。已经研究了针对参数组合的另一种方法，该方法旨在将功率非常低或什至没有功率的应用程序与非典型参数（例如Scrub）结合使用。 scrub参数可替代Power，该Power将Cu导线之间的焊接接触传递到引线框架键合指表面。预装的机器软件具有可以创建分段的清理应用程序的功能。在缝线粘合性响应和形成方面进行了显着改进的验证。它还致力于最小化毛细管尖端的积聚，这有助于延长毛细管寿命，这对于成本也是有利的。

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