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A novel test method of low leakage rate of MEMS vacuum packaging

机译：MEMS真空包装低泄漏率的新测试方法

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摘要

With the development of MEMS technology, especially the development of packaging technology, more and more MEMS devices require the vacuum packaging to improve their performances. However, MEMS vacuum packaging technology has been a technical problem for many years. Currently, we still can't truly achieve the low leakage rate vacuum packaging of MEMS devices. Meanwhile, the existing detecting method can't accurately measure low leakage rate. For these reasons, this paper carried out a novel test method to detect the low leakage rate of MEMS vacuum packaging. The use of a crystal to real-time monitoring the vacuum level inside of the envelope to get indirect leakage rate of the envelope was proposed. Through the work of crystal calibration, data testing, modification and re-testing, finally, we got a MEMS vacuum packaging envelope with the leakage rate of 3.2×10Pa·m/s by the FC135 Patch crystal.
机译：随着MEMS技术的发展，特别是封装技术的发展，越来越多的MEMS器件需要真空封装以提高其性能。但是，MEMS真空包装技术已经成为技术难题很多年了。目前，我们仍然无法真正实现MEMS器件的低泄漏率真空封装。同时，现有的检测方法无法准确地测量低泄漏率。由于这些原因，本文进行了一种新颖的测试方法来检测MEMS真空包装的低泄漏率。提出了使用晶体实时监测包封内部的真空度以获取包封的间接泄漏率的建议。通过晶体校准，数据测试，修改和重新测试的工作，最后，我们得到了FC135贴片晶体的MEMS真空封装外壳，泄漏率为3.2×10Pa·m / s。

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