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High aspect ratio etch yield improvement by a novel polymer dump thickness metrology

机译：通过新型聚合物倾卸厚度测量技术提高高深宽比蚀刻产量

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Unexpected yield loss in high-volume DRAM manufacturing occurs very often as an excursion in critical levels such as high aspect ratio container (HARC) etch in capacitor formation in the device. The main failure mode is polymer formation and plasma density change during the chamber preventive maintenance. In this paper we study the effect of polymer formation on HARC profile at various electrostatic chuck (ESC) temperatures and demonstrate a novel and advanced inline metrology - polymer dump thickness measurement - to automatically detect chamber deviation and significantly improve the yield.

机译：高容量DRAM制造中意外的良率损失非常经常发生，因为这种临界水平的偏移（例如器件中电容器形成中的高长宽比容器（HARC）蚀刻）会发生。主要的故障模式是在腔室预防性维护期间聚合物形成和等离子体密度变化。在本文中，我们研究了在各种静电卡盘（ESC）温度下聚合物形成对HARC轮廓的影响，并展示了一种新颖且先进的在线计量技术-聚合物倾卸厚度测量-可自动检测腔室偏差并显着提高产量。

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《》|2015年|161-166|共6页
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Ye Jeff J.; Ega Ganga R.; Thompson Shaun P.;
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Capacitor; Contact etch; Container; DRAM; HARC; Plasma etch; Polymer; Polymer dump thickness;

机译：电容器;接触蚀刻;容器; DRAM; HARC;等离子蚀刻;聚合物;聚合物堆放厚度;

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1. Anisotropic high aspect ratio etch for perfluorcyclobutyl polymers with stress relief technique [J] . Rahmanian N, Kim S, Nordin GP Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures . 2006,第6期

机译：利用应力消除技术对全氟环丁基聚合物进行各向异性的高深宽比蚀刻
2. Effects of aspect ratio and metal layer thickness on demoulding of metal/polymer bilayer gratings during nanoimprinting [J] . Xu Zheng, Qing Wang, Rui Zhang, Scientific reports. . 2018,第1期

机译：纵横比和金属层厚度对纳米印刷期间金属/聚合物双层光栅脱模的影响
3. Injection moulding of high aspect ratio micron-scale thickness polymeric microcantilevers [J] . A W MCFARLAND, M A POGGI, L A BOTTOMLEY Nanotechnology . 2004,第11期

机译：高纵横比微米级厚度聚合物微悬臂梁的注塑成型
4. High aspect ratio etch yield improvement by a novel polymer dump thickness metrology [C] . Ye Jeff J., Ega Ganga R., Thompson Shaun P. Annual SEMI Advanced Semiconductor Manufacturing Conference . 2015

机译：通过新型聚合物倾倒厚度计量的高纵横比蚀刻产量改善
5. Correction of aspect ratio dependency in deep silicon etch using SF6/C4F8/Ar gas mixture. [D] . Bates, Robert Lee. 2014

机译：校正使用SF6 / C4F8 / Ar气体混合物进行深硅蚀刻时的长宽比依赖性。
6. Effects of aspect ratio and metal layer thickness on demoulding of metal/polymer bilayer gratings during nanoimprinting [O] . Xu Zheng, Qing Wang, Rui Zhang, -1

机译：长宽比和金属层厚度对纳米压印过程中金属/聚合物双层光栅脱模的影响
7. Surface Rippling Ion Etch Yields of Diamond Using a Focused Ion Beam: With or Without Enhanced-Chemistry, Aspect Ratio Regulates Ion Etching [O] . W. J. MoberlyChan, T. E. Felter, M. A. Wall 2006

机译：使用聚焦离子束的表面波纹和离子蚀刻产量：有或没有增强化学，纵横比调节离子蚀刻
8. Summary of some rocket-model investigations of effects of wing aspect ratio and thickness on aileron rolling effectiveness including some effects of spanwise aileron location for sweptback wings with aspect ratio of 8 [R] . Strass, H Kurt 1954

机译：关于机翼纵横比和厚度对副翼滚动效果影响的一些火箭模型研究综述，包括翼展副翼位置对纵横比为8的后掠翼的影响

High aspect ratio etch yield improvement by a novel polymer dump thickness metrology

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