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Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools

机译:使用电子束检查工具上的掩模版缺陷检查,研究晶圆上掩模版缺陷的可印刷性

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In this paper we evaluate the Reticle Defect Review feature on KLA-Tencor's e-beam review tool, eDR™-7110, and study defect printability of reticle defects on wafer. The RDR feature is able to read KLA-Tencor's reticle inspection results directly without any intermediate format, thus allowing what-you-see-is-what-you-get setup on the wafer review tool. Compared with a conventional reticle to wafer approach using KLA Results Files, Reticle Defect Review provides faster time to results, more accurate defect disposition and increased ease of use, which have been demonstrated by the printability study of reticle defects on a focus exposure matrix wafer.
机译:在本文中,我们评估了KLA-Tencor的电子束检查工具eDR™-7110上的掩模版缺陷检查功能,并研究了掩模版缺陷在晶圆上的可印刷性。 RDR功能能够直接读取KLA-Tencor的掩模版检查结果,而无需任何中间格式,从而允许您在晶片查看工具上看到所见即所得的设置。与使用KLA结果文件的传统标线到晶片方法相比,“标线缺陷查看”提供更快的结果生成时间,更准确的缺陷位置和更高的易用性,这已通过对焦点曝光矩阵晶片上的标线缺陷进行可印性研究得到了证明。

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