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Stability of fully printed flexible thermistors under static and dynamic thermal stressing

机译：全印刷柔性热敏电阻在静态和动态热应力下的稳定性

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The growing demand for sensors required to fulfil the vision of embedding electronic functionalities into literally every object surrounding us in a daily life could be satisfied by the means of printed electronics. This work is focused on fully screen-printed temperature sensors on PET foil and characterization of their stability under dynamic and static thermal stressing. Two proprietary metal-oxide based thermosensitive formulations were used to prepare printed thermistors, which were either non-encapsulated or protected with a foil lamination. Sensors were subjected to dynamic thermal cycling right after their preparation ((10-50) °C /216h) and then again after the additional thermal annealing (50 °C /72h). Despite the dissimilar relative resistance change during the first dynamic cycling, after the annealing both thermosensistive formulations exhibited very similar behaviour. The foil lamination turned out to eliminate resistance fluctuations during the static themal stressing and it also maintained lower relative resistance drift during dynamic thermal stressing.
机译：为了满足将电子功能嵌入日常生活中几乎每个物体的愿景，对传感器的需求不断增长，这可以通过印刷电子技术来满足。这项工作的重点是在PET箔上完全丝网印刷的温度传感器，以及在动态和静态热应力下其稳定性的特性。使用两种基于金属氧化物的专有热敏配方来制备印刷的热敏电阻，该热敏电阻可以是非封装的，也可以通过箔层压保护。传感器在准备好之后（（10-50）°C / 216h）进行动态热循环，然后在额外的热退火（50°C / 72h）之后再次进行动态热循环。尽管在第一个动态循环过程中相对电阻变化不一样，但是在退火之后，两种热敏配方都表现出非常相似的性能。事实证明，箔片叠层消除了静态热应力期间的电阻波动，并且在动态热应力期间还保持了较低的相对电阻漂移。

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