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Die-to-database defect detection for reticles of 64- and 256-Mbit DRAMs

机译:管芯到数据库的缺陷检测,用于64和256 Mbit DRAM的标线

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Abstract: The development and production of 64 and 256 Mbit DRAMs presents new challenges to mask defect detection. As happened during the development of previous generations of DRAMs, the decrease in line/space design rule dictates a similar decrease in the specification of mask defect size. This trend introduces new technologies and new requirements. This paper is concerned with two evolving technologies: layout modification for optical proximity correction (OPC) and phase-shift masks (PSM). The new technologies pose many issues for the mask maker. In this paper the defect detection is addressed. In section 2 few cases of OPC reticle inspection are presented while in section 3 the defect detection of PSM is discussed.!2
机译:摘要:64和256 Mbit DRAM的开发和生产对掩盖缺陷检测提出了新的挑战。正如在前几代DRAM的开发过程中所发生的那样,线/空间设计规则的减少表明掩模缺陷尺寸的规格也有类似的减少。这种趋势引入了新技术和新要求。本文涉及两种正在发展的技术:用于光学邻近校正(OPC)和相移掩模(PSM)的布局修改。新技术给面膜制造商带来了许多问题。在本文中,解决了缺陷检测。在第2节中,介绍了一些OPC掩模版检查的案例,而在第3节中,讨论了PSM的缺陷检测。!2

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