Optimization of 28nm HK/MG single wafer cleaning process

机译：优化28nm HK / MG单晶片清洗工艺

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Wet chemical processes are used in a variety of integrated circuit (IC) fabrication processing steps, also single wafer wet processing tools have become part of the critical tool-set in advanced IC manufacturing. How to clean trench bottom efficiently and effectively is a really challenging job for wet process. In this paper, we studied and found that multi clean steps are much better than single clean step process, while optimizing D.I scan range and N2 flow would further improve the performance. It works in 28nm HK/MG NMOS clean process.

机译：湿法化学工艺用于各种集成电路（IC）制造工艺步骤中，单晶片湿法加工工具也已成为高级IC制造中关键工具集的一部分。对于湿法工艺而言，如何有效而有效地清洗沟槽底部是一项真正具有挑战性的工作。在本文中，我们研究发现，多次清洁步骤比一次清洁步骤要好得多，同时优化D.I扫描范围和N2流量将进一步提高性能。它适用于28nm HK / MG NMOS清洁工艺。

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《China Semiconductor Technology International Conference》|2016年|1-3|共3页
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Haihui Liang; JiaLei Liu; HuanXin Liu; Yonggen He; Jingang Wu; Xiaojing Ge; Christian Haigermoser;
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D.I scan range; Multi-Clean steps; N2 flow optimization; Single wafer clean;

机译：D.I扫描范围;多步清洁; N2流量优化;单晶片清洁;

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机译：在300mm晶圆厂中实施单晶圆清洁工具的过程，环境和经济方面的考虑
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机译：使用波导模式的新型超声波清洗设备在单晶圆清洗过程中的应用
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机译：使用90nm及以上的单晶圆清洗工艺改善接触清洗
4. Optimization of 28nm HK/MG single wafer cleaning process [C] . Haihui Liang, JiaLei Liu, HuanXin Liu, China Semiconductor Technology International Conference . 2016

机译：优化28nm HK / Mg单晶片清洁过程
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机译：在化学机械抛光和晶圆清洁过程中，亚微米颗粒的粘附和去除。
6. Optimization and Modeling of Slightly Acidic Electrolyzed Water for the Clean-in-Place Process in Milking Systems [O] . Yu Liu, Chaoyuan Wang, Zhengxiang Shi, 2020

机译：挤奶系统清理工艺微酸电解水的优化与建模
7. Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow [O] . Jianshe Tang, Brian J. Brown, Steven Verhaverbeke, 2015

机译：水基单晶硅Cu / Low-k清洗工艺表征与双镶嵌工艺流程的集成
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机译：开发和优化基于低温气溶胶的晶片清洁系统

Optimization of 28nm HK/MG single wafer cleaning process

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