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首页> 外文会议>China Semiconductor Technology International Conference >Silver flakes filled interpenetrating polymer network: High performance electrically conductive adhesives for electronic packaging
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Silver flakes filled interpenetrating polymer network: High performance electrically conductive adhesives for electronic packaging

机译：银片填充的互穿聚合物网络：用于电子包装的高性能导电胶

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Interpenetrating Polymer Network (IPNs) formed from a model triallyl isocyanurate (TAIC) and dicyandiamide-cured epoxy resin (Epon 828) has been introduced into conductive adhesive formula. The curing behavior and the compatibility of the networks were investigated by differential scanning calorimeter (DSC). The test result indicated that IPN have good compatibility. In addition, compared with a system composed of bare dicyandiamide-curing (Epon 828), the viscosity of adhesive based on the IPNs was decreased sharply as much as by 69%, and glass transition temperature (Tg) remains at a higher level. Compared with the ICAs based on dicyandiamide-curing (Epon 828) which has a resistivity of 3.12??10???3????cm and a shear strength of 13.6 MPa, ICAs based on IPN with a weight ratio of TAIC/Epon 828 = 2/10 shows a much lower volume resistivity of 1.02??10???3 ????cm and a much higher shear strength of 17.03 MPa, which was considered to be an ideal ICA candidate for electronic packaging applications.
机译：由模型三烯丙基异氰脲酸酯（TAIC）和双氰胺固化的环氧树脂（Epon 828）形成的互穿聚合物网络（IPN）已被引入导电胶配方中。通过差示扫描量热仪（DSC）研究了网络的固化行为和相容性。测试结果表明IPN具有良好的兼容性。另外，与由裸露的双氰胺固化的体系（Epon 828）相比，基于IPN的粘合剂的粘度急剧降低了69％，并且玻璃化转变温度（Tg）保持在较高水平。与基于双氰胺固化的ICAs（Epon 828）的电阻率为3.12？10 ??? 3 ???? cm和抗剪强度为13.6 MPa相比，基于IPN的ICAs的重量比为TAIC / Epon 828 ＝ 2/10表明体积电阻率低得多，为1.02×10 -3×3Ω·cm，剪切强度为高得多，为17.03MPa，被认为是电子包装应用的理想ICA候选物。

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