• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>China Semiconductor Technology International Conference >Ultra wafer thinning and dicing technology for stacked die packages
【24h】

Ultra wafer thinning and dicing technology for stacked die packages

机译：用于堆叠管芯封装的超薄晶圆减薄和切割技术

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

As the demand is increasing for memory cards, portable computing systems, multiple chip packages (MCPs), and other applications that require thin integrated circuits (ICs), the wafer thinning for advanced packaging methods become more and more important. This paper gives an overview of the different industrial wafer thinning and dicing techniques, including dicing after grinding (DAG), dicing before grinding (DBG), laser cut after grinding (LAG), and laser stealth dicing before grinding (SDBG). The process capability for each process was compared, and the challenges encountered during thinning and dicing the wafer to be 25 um thickness are analyzed. Potential process issues have been investigated, including die strength and subsurface damage that is associated with these processes and mechanical properties, such as surface conditions and die warpage etc. Die strength test configurations and criteria are also included.
机译：随着对存储卡，便携式计算系统，多芯片封装（MCP）以及需要薄集成电路（IC）的其他应用的需求不断增长，用于高级封装方法的晶圆减薄变得越来越重要。本文概述了不同的工业晶圆薄化和划片技术，包括磨削后切割（DAG），磨削前切割（DBG），磨削后激光切割（LAG）和磨削前激光隐形切割（SDBG）。比较了每种工艺的工艺能力，并分析了在将晶圆减薄和切成25 um厚度时遇到的挑战。已经研究了潜在的工艺问题，包括与这些工艺和机械性能（例如表面条件和模具翘曲等）相关的模具强度和表面下损坏。还包括模具强度测试配置和标准。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号