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Design considerations for three dimensional integrated circuits for aerospace applications

机译：航空航天应用三维集成电路的设计注意事项

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Three dimensional integrated circuits (3DICs) allow for increased device density and performance while also facilitating heterogeneous integration of different functionalities into one 3D stack. These features can be leveraged in the implementation of innovative multi-purpose 3DICs for aerospace applications which often require high performance multi-functional chips for a variety of applications. This work will detail our in-house technological capabilities for the implementation of high performance 3DICs, with an example of an asynchronous field programmable gate array (AFPGA) prototype that was fabricated using our state-of-the-art facilities for prototyping a multitude of asynchronous applications. The 3D AFPGA architecture has shown great promise for the realization of logic in a fast and variation-tolerant manner which is especially critical for aerospace applications. Our in-house 3D technology will be illustrated and details on the technology modeling and CAD framework will be provided. The framework developed can be utilized by other users in the design of 3D integrated circuits for our 3D technology. This work will also showcase the various design constraints to be considered for the implementation of high performance 3DICs, in particular speed, area and power. Different transmission techniques for ultra-high speed signal communication within the 3DIC stack will be explored and results will detail considerations for choice of transmission schemes. Layout schemes will illustrate how design layout complexity can be tailored for gains with respect to area, speed and power. Also illustrated are ways to extend existing 2D layouts for manufacturing better-performing 3D counterparts. Detailed analyses of the design complexity versus performance optimization will show how the final 3DIC implementation would be based on given time and cost constraints. This work will also detail ways to integrate heterogeneous dies in a 3D stack, in particular sensors, for multi-f- nctional aerospace applications.
机译：三维集成电路（3DIC）可以提高设备密度和性能，同时还可以促进将不同功能异构集成到一个3D堆栈中。这些功能可在航空航天应用的创新多功能3DIC实施中加以利用，而航空航天应用通常需要针对各种应用的高性能多功能芯片。这项工作将详细介绍我们用于实现高性能3DIC的内部技术能力，并举例说明一个异步现场可编程门阵列（AFPGA）原型，该原型是使用我们先进的设备制造的，用于对多种设备进行原型设计。异步应用程序。 3D AFPGA体系结构已显示出以快速且耐变化的方式实现逻辑的巨大希望，这对于航空航天应用而言尤其重要。我们将演示内部3D技术，并提供有关技术建模和CAD框架的详细信息。开发的框架可供其他用户用于我们3D技术的3D集成电路设计中。这项工作还将展示为实现高性能3DIC而要考虑的各种设计约束，特别是速度，面积和功率。将探讨3DIC堆栈中用于超高速信号通信的不同传输技术，其结果将详细考虑选择传输方案的注意事项。布局方案将说明如何针对面积，速度和功率方面的增益来定制设计布局的复杂性。还说明了扩展现有2D布局以制造性能更好的3D副本的方法。设计复杂性与性能优化的详细分析将显示最终3DIC实施将如何基于给定的时间和成本约束。这项工作还将详细说明将异类芯片集成到3D堆栈中的方法，特别是用于多功能航空航天应用的传感器。

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