• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>SMTA international conference >ATTACHMENT QUALITY AND THERMAL FATIGUE RELIABILITY OF A SURFACE MOUNT CHIP RESISTOR ASSEMBLED WITH A LOW TEMPERATURE SOLDER
【24h】

ATTACHMENT QUALITY AND THERMAL FATIGUE RELIABILITY OF A SURFACE MOUNT CHIP RESISTOR ASSEMBLED WITH A LOW TEMPERATURE SOLDER

机译：低温焊料装配的表面贴装电阻的安装质量和热疲劳可靠性

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Technical, economic, and environmental requirements are driving the development and usage of low temperature solders (LTS) for electronic assembly. The leading alloy candidates for achieving soldering below 200°C are based on the Bi-Sn solder system that has a melting point of 138 °C at its eutectic composition. One of the concerns with these alloys is low thermal fatigue life, which has been linked to their characteristically brittle, two-phase lamellar microstructure. The industry has been focused largely on the challenges of mixed metallurgy ball grid array (BGA) assembly (SAC BGA assembled with LTS solder paste), while a gap exists in assembly and reliability data for other components attached solely with a LTS paste. In this study, a daisy chained printed circuit board (PCB) test vehicle was used to evaluate the thermal fatigue reliability of the solder joints of a 2512 chip resistor assembled with a commercial LTS compared to a SAC305 performance baseline. Two PCB surface finishes were included as variables, immersion Ag (IAg) and immersion Sn (ImmSn). ImmSn may have solderability limitations due to Cu-Sn intermetallic (IMC) growth and oxidation resulting from multiple reflow processes or exposure during long term storage. The potential for final finish degradation and loss of solderability were addressed using high temperature storage and reflow preconditioning as additional variables. Thermal cycling was used to characterize and compare the resistor thermal fatigue reliability with LTS and SAC305, and to assess any effects of surface finish and preconditioning. The interconnect metallurgy and microstructural characterization were compared for all solder alloys and surface finishes and discussed in relation to the thermal cycling results.
机译：技术，经济和环境要求正在推动用于电子装配的低温焊料（LTS）的开发和使用。在低于200°C的温度下实现焊接的主要合金候选材料是基于Bi-Sn焊料系统，其共晶成分的熔点为138°C。这些合金的关注点之一是低热疲劳寿命，这与它们的特征性脆性两相层状微结构有关。业界一直将主要精力集中在混合冶金球栅阵列（BGA）组装（使用LTS焊膏组装的SAC BGA）的挑战上，而仅通过LTS焊膏附着的其他组件的组装和可靠性数据方面存在差距。在这项研究中，使用菊花链式印刷电路板（PCB）测试工具评估了与商用LTS组装在一起的2512芯片电阻器的焊点的热疲劳可靠性，并将其与SAC305性能基准进行了比较。包括两个PCB表面光洁度作为变量，浸入Ag（IAg）和浸入Sn（ImmSn）。由于Cu-Sn金属间化合物（IMC）的生长和长期回流过程中多次回流或暴露导致的氧化，ImmSn可能具有可焊性限制。使用高温存储和回流预处理作为附加变量，解决了最终成品降解和可焊性降低的可能性。使用热循环来表征和比较电阻器与LTS和SAC305的热疲劳可靠性，并评估表面光洁度和预处理的任何影响。比较了所有焊料合金和表面光洁度的互连冶金和微观结构特征，并就热循环结果进行了讨论。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号