IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

机译：IEEE第10届电子封装电气性能专题会议（目录号01TH8565）

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The 10th Topical Meeting on Electrical Performance of Electronic Packaging provides a forum for the presentation and discussion of the latest advances in electrical design, analysis and characterization of on-chip and package interconnections and structures for digital, mixed signal, RF, microwave and mm-wave applications. The following topics are dealt with: server systems; RF/microwave; transmission line modeling; power distribution; EM modeling; model order reduction; power decoupling; system design, measurement and modeling; low power issues.

机译：第十届电子封装电气性能专题会议为介绍和讨论数字，混合信号，RF，微波和毫米波芯片上和封装互连及结构的电气设计，分析和表征的最新进展提供了一个论坛。波浪应用。处理以下主题：服务器系统;射频/微波传输线建模;电力调配;电磁建模模型订单减少;功率去耦;系统设计，测量和建模;低功耗问题。

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《Electrical Performance of Electronic Packaging, 2001》|2001年||共1页
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中图分类无线电电子学、电信技术;
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1. Foreword contributions from the eighth topical meeting on electrical performance of electronic packaging [J] . Deutsch A., Swaminathan M. IEEE Transactions on Advanced Packaging . 2000,第3期

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2. Contributions from the seventh topical meeting on electrical performance of electronic packaging [J] . Deutsch A., Swaminathan M. IEEE Transactions on Advanced Packaging . 1999,第3期

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3. Foreword Contributions From The Sixth Topical Meeting On Electrical Performance Of Electronic Packaging [J] . Deutsch A., Prince J.L. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1998,第4期

机译：第六届电子包装电气性能专题会议前言
4. IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) [C] . Institute of Electric and Electronic Engineer Topical Meeting on Electrical Performance of Electronic Packaging . 2001

机译：IEEE第10次电子包装电气性能局部会议（猫。01号01th8565）
5. Electrical Design Considerations and Packaging of Power Electronic Modules [D] . Wang, Shijie 2013

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8. Improving Emergency Response and Human-Robotic Performance. Joint Meeting and Conference of the Institute of Electrical and Electronics Engineers (IEEE) and Human Performance/Root Cause/Trending/Operating Experience/ and Self Assessment (HPRCT) [R] . Gertman, D. I. 2007

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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