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A Study on Discolored Bondpads and Galvanic Corrosion

机译：变色邦德和电铜腐蚀的研究

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Discolored bondpads failure was investigated. SEM & EDX techniques were used to identify the root causes. The results show that discolored bondpads are caused by many holes on bondpads due to galvanic corrosion. It is most severe at power-line pads and less severe on rest of pads in the die. These bondpad holes have led to poor contact between the wire & integrated circuits and faulty computer chips. The holes are most likely to be caused by galvanic corrosion as there is a nucleus centered inside almost all holes. EDX results on the nucleus show high Cu concentration comparing to that on normal area. It is concluded that galvanic corrosion was due to DI water problem during wafer sawing at assembly. In this paper, the mechanism of galvanic corrosion will be further discussed.
机译：调查了变色的BondPads失败。 SEM和EDX技术用于识别根本原因。结果表明，由于电流腐蚀，粘结板上的许多孔都是褪色的债券。电源线垫最严重，在模具中的剩余垫上不太严重。这些BondPad孔导致电线和集成电路和有故障的计算机芯片之间的接触不良。孔最有可能是由电流腐蚀引起的，因为在几乎所有孔中都有一个核心。 EDX结果对核显示出高CU浓度与正常区域相比。结论是，电流腐蚀是由于晶片在组装时锯切期间的DI水问题。在本文中，将进一步讨论电抗腐蚀机制。

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