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New Maskless Micro-Fabrication Technique of Singlecrystal Silicon using the Combination of Nanometer-scale Machining and Wet Etching

机译:单型硅的新型无面罩微制造技术,使用纳米级加工和湿法蚀刻的组合

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This paper describes a new maskless micro-fabrication technique using the combination of nanometer-scale mechanical machining and wet etching. First, the (100) surface of a single-crystal silicon is machined by using the nano-machining system, which utilises the mechanism of the friction force microscope (FFM.) Next, the material is etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of the masking or promotion effect of the affected layer generated by nano-machining. To investigate this interesting effect, the affected layer was analysed. Moreover, some test structures were fabricated by using the masking effect.
机译:本文介绍了一种新的无面罩微制造技术,使用纳米级机械加工和湿法蚀刻的组合。首先,通过使用纳米加工系统加工单晶硅的(100)表面,该系统利用摩擦力显微镜(FFM。)的机制接下来,通过KOH溶液蚀刻材料。在蚀刻过程之后,由于纳米加工产生的受影响层的掩蔽或促进效果,制造凸起结构或更深的孔。为了调查这种有趣的效果,分析了受影响的层。此外,通过使用掩蔽效果制造一些测试结构。

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