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Effect of Metal Coating on Sn Whisker Growth at Welded Zone

机译：金属涂层对焊接区SN晶须生长的影响

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摘要

From the early 1980s, the problem of Sn whiskers in welded electronic components was suppressed by adding Pb as an alloying element to Sn solder. However, since the beginning of the 21st century, Pb has been phased out from solder because of its toxicity, and Sn whiskers have become a problem again. Sn whisker growth can cause an electrical short resulting in system failure. In this study, the effects of metal coating on Sn whisker growth in welded electronic parts were observed. In particular, we observed that Sn electroplating prevented Sn whisker growth in the welded zone. After producing a lead wire for an aluminum electrolytic capacitor by arc stud welding, the weld zone was coated by Sn electroplating. The samples were subjected to an ambient storage test at room temperature. Only one whisker was observed, even after 4000 h ambient storage, demonstrating that Sn electroplating strongly suppressed whisker growth. The whisker suppression mechanism was different from the effect of pressing such as in conformal coating. We concluded that the whisker suppression was caused by atomic diffusion of Sn during electroplating and the Sn plating coating absorbed the residual stress of the interior Sn.
机译：从20世纪80年代初期，通过将Pb作为合金元素添加到Sn焊料，抑制了焊接电子元件中的SN晶须的问题。然而，自21世纪初以来，由于其毒性，PB已经从焊料中逐渐淘汰，而SN晶须再次成为一个问题。 SN晶须增长可能导致电气短路导致系统故障。在这项研究中，观察了金属涂层对SN晶须生长在焊接电子部件中的影响。特别地，我们观察到Sn电镀阻止了焊接区域中的SN晶须生长。通过弧形螺柱焊接为铝电解电容器产生引线后，通过SN电镀涂覆焊接区。将样品在室温下进行环境储存试验。只有一个晶须观察到，即使在4000小时内储存后，也展示了SN电镀强烈抑制的晶须生长。晶须抑制机制与压制诸如保形涂层的效果不同。我们得出结论，晶须抑制是由电镀期间Sn的原子扩散引起的，并且Sn电镀涂层吸收内部Sn的残余应力。

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