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首页> 外文会议>IMAPS/ACerS International Conference and Exhibition on CICMT >Zero Shrinkage of LTCC by Self-Constrained Sintering
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Zero Shrinkage of LTCC by Self-Constrained Sintering

机译：通过自我限制烧结零缩减LTC

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Low shrinkage in x- and y-direction and low tolerances of shrinkage are an indispensable precondition for high-density component configuration. Therefore zero shrinkage sintering technologies as pressure assisted sintering and sacrificial tapes have been introduced in the LTCC production by different manufacturers. Disadvantages of these methods are high costs of sintering equipment and an additional process step to remove the sacrificial tapes. In this paper newly developed self-constrained sintering methods are presented. The new technology, HeraLock, delivers LTCC-modules with a sintering shrinkage in x- and y-direction of less than 0.2% and with a shrinkage tolerance of +/-0.02% without sacrificial layers and external pressure. Each tape is self-constrained by integration of a layer showing no shrinkage in the sintering temperature range of the LTCC. Large area metallization, integration of channels, cavities and passive electronic components are possible without waviness and camber. Self-constrained laminates are an alternative way to produce zero shrinkage LTCC. They consist of tapes sintering at different temperature intervals. Precondition for a successful production of a self-constrained LTCC laminate is the development of well adapted material and tapes, respectively. This task is very challenging, because sintering range, high-temperature reactivity and thermal expansion coefficient have to be matched and each tape has to fulfill specific functions in the final component, which requires the tailoring of many properties as permittivity, dielectric loss, mechanical strength and roughness. A self-constrained laminate is introduced in this paper. It consists of inner tapes sintering at especially low temperature range between 650 °C and 720 °C and outer tapes with an as-fired surface suitable for thin film processes.
机译：X和Y方向的低收缩和收缩的低公差是高密度分量配置的必不可少的前述前提。因此，由于不同的制造商，在LTCC生产中引入了零收缩烧结技术作为压力辅助烧结和牺牲胶带。这些方法的缺点是烧结设备的高成本和移除牺牲胶带的额外工艺步骤。在本文中，介绍了新开发的自我限制烧结方法。新技术预示着，在X和Y方向上具有烧结收缩的LTCC模块小于0.2％，并且+/- 0.02％的收缩耐受性而没有牺牲层和外部压力。通过集成在LTCC的烧结温度范围内没有收缩的层，每个磁带被自限制。大面积金属化，通道的整合，空腔和被动电子元件也是可能的，没有波纹和弯曲。自我限制的层压板是产生零收缩LTCC的替代方法。它们由不同的温度间隔烧结组成。成功生产自我限制LTCC层压板的前提是开发适应性良好的材料和胶带。这项任务非常具有挑战性，因为必须匹配烧结范围，高温反应性和热膨胀系数，并且每个磁带必须满足最终组件中的特定功能，这需要剪裁许多性能作为介电常数，介电损耗，机械强度和粗糙。本文介绍了一种自我约束的层压板。它包括在650°C和720°C和720°C和外部带的内部胶带烧结，以及适合于薄膜工艺的带式带的外部带。

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