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首页> 外文会议>2005 IMAPS/ACerS 1st international conference and exhibition on ceramic interconnect and ceramic microsystems technologies (CICMT) >Zero Shrinkage of LTCC by Self-Constrained Sintering
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Zero Shrinkage of LTCC by Self-Constrained Sintering

机译：自约束烧结实现LTCC零收缩

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摘要

Low shrinkage in x- and y-direction and low tolerances of shrinkage are an indispensable precondition for highdensityrncomponent configuration. Therefore zero shrinkage sintering technologies as pressure assisted sinteringrnand sacrificial tapes have been introduced in the LTCC production by different manufacturers. Disadvantages ofrnthese methods are high costs of sintering equipment and an additional process step to remove the sacrificialrntapes. In this paper newly developed self-constrained sintering methods are presented.rnThe new technology, HeraLock?, delivers LTCC-modules with a sintering shrinkage in x- and y-direction of lessrnthan 0.2 % and with a shrinkage tolerance of +/-0.02 % without sacrificial layers and external pressure. Eachrntape is self-constrained by integration of a layer showing no shrinkage in the sintering temperature range of thernLTCC. Large area metallization, integration of channels, cavities and passive electronic components arernpossible without waviness and camber.rnSelf-constrained laminates are an alternative way to produce zero shrinkage LTCC. They consist of tapesrnsintering at different temperature intervals. Precondition for a successful production of a self-constrained LTCCrnlaminate is the development of well adapted material and tapes, respectively. This task is very challenging,rnbecause sintering range, high-temperature reactivity and thermal expansion coefficient have to be matched andrneach tape has to fulfil specific functions in the final component, which requires the tailoring of many propertiesrnas permittivity, dielectric loss, mechanical strength and roughness. A self-constrained laminate is introduced inrnthis paper. It consists of inner tapes sintering at especially low temperature range between 650 ℃ and 720 ℃rnand outer tapes with an as-fired surface suitable for thin film processes.
机译：x和y方向的低收缩率以及低的收缩容差是高密度组件配置必不可少的前提。因此，不同制造商已将零收缩烧结技术（如压力辅助烧结和牺牲带）引入了LTCC生产中。这些方法的缺点是烧结设备的成本高以及去除牺牲性胶带的附加工艺步骤。本文介绍了新开发的自约束烧结方法。新技术HeraLock？提供的LTCC模块在x和y方向上的烧结收缩率小于0.2％，并且其收缩公差为+/- 0.02％没有牺牲层和外部压力。每种胶带都通过在LTCC的烧结温度范围内显示无收缩的层的整合而自我约束。大面积金属化，通道，型腔和无源电子元件的集成是不可能的，而不会产生波纹和弯曲。自约束层压板是生产零收缩LTCC的替代方法。它们由在不同温度间隔下的烧结带组成。成功生产自约束LTCC层压板的前提是分别开发适应性强的材料和胶带。此任务非常具有挑战性，因为必须匹配烧结范围，高温反应性和热膨胀系数，并且每个胶带必须在最终组件中履行特定的功能，这需要对许多性能进行定制，例如介电常数，介电损耗，机械强度和粗糙度。本文介绍了一种自约束层压板。它由在650℃至720℃的极低温度范围内烧结的内带和外层带经烧制的表面制成，适合薄膜工艺。

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