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MICROSTRUCTURAL STUDIES OF HOT PRESSED SILICON CARBIDE CERAMIC

机译:热压碳化硅陶瓷的微观结构研究

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Silicon Carbide (SiC) ceramics belong to an important class of structural materials used for high temperature applications. The specific attributes that account for their utility as engineering ceramics are high value of thermal conductivity together with lower thermal expansion coefficient, thereby having higher thermal shock resistance. High mechanical strength also plays a vital role for considering SiC as structural components in various devices. However, it is difficult to densify SiC even at elevated temperature because of the covalent nature of its bond. In the present work, fine powder of ?-SiC mixed with sintering additives (Al, B, C) was hot pressed at 32 MPa in graphite die at various temperatures in the range of 1700-1900°C under vacuum. Hot pressing at 1900°C yielded a fully dense material. Optical micrographs showed presence of elongated grain of a-SiC. Fracture surface of SiC observed under scanning electron microscope (SEM) revealed the occurrence of liquid phase sintering. The grain boundaries appeared to be free of secondary phase as revealed from the bright field conventional transmission electron microscopy (TEM) images. High-resolution electron microscopy analysis, however, provided evidence for distribution of amorphous phase at the grain triple junction. Hardness and toughness of the hot pressed SiC were found to be in the range of 20-22 Hv_(0.1) and 2.5-3.0MPa.m respectively. Flexural strength of the highly dense samples was found to be in the range of 225-240MPa.
机译:碳化硅(SiC)陶瓷属于用于高温应用的重要组织材料。作为工程陶瓷的实用性的特定属性是热导率的高值,其热膨胀系数较低,从而具有更高的耐热冲击性。在考虑各种装置中的结构部件,高机械强度也起到重要作用。然而,由于其键的共价性质,难以使SiC致密化。在本作工作中,与烧结添加剂(Al,B,C)混合的细粉末在32MPa的真空下在2700-1900℃的温度下热压在32MPa中。 1900°C的热压产生完全致密的材料。光学显微照片显示出存在细长的A-SiC颗粒。在扫描电子显微镜(SEM)下观察SiC的断裂表面显示出液相烧结的发生。晶界似乎是从明场常规透射电子显微镜(TEM)图像的透露的二次相。然而,高分辨率电子显微镜分析为晶粒三界分布了非晶相的证据。发现热压SiC的硬度和韧性分别为20-22HV_(0.1)和2.5-3.0MPa的范围。发现高致密样品的抗弯强度在225-240MPa的范围内。

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