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Trap Spectroscopy in Si_3N_4 Ultrathin Films Using Exoelectron Emission Method

机译:使用exoelectron发光法在Si_3N_4超薄膜中的捕获光谱

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We developed an original thermally stimulated exoelectron emission spectroscopy method (TSEE) of measurements of the activation energy Φ of electron (hole) traps in ultrathin Si_3N_4 films. The temperature spectra of TSEE of 50A silicon nitride films demonstrate several peaks: three low temperature peaks (T_1 = 373K, T_2 = 423K, T_3 = 498K) and a high temperature maximum at T_4 ~ 750K. The obtained values of the energy activation are Φ_1 = 0.82 eV, Φ_2 = 0.93 eV, Φ + 1.09 eV, and Φ_4 = 1.73 eV. TSEE results are shown to be consistent with Φ estimates obtained from microFLASH two bit per cell memory transistor measurements. Electrons stored at traps with Φ_4 = 1.73 eV explain excellent microFlash retention properties. We believe that deep traps in Silicon Nitride are Hydrogen containing centers, while Hydrogen hopping is the route cause of observed material degradation in course of TSEE measurements.
机译:我们开发了一种原始的热刺激的exoelectron发射光谱法(Tsee)的超薄Si_3N_4薄膜中电子(孔)捕集器的激活能量φ的测量。 50A氮化硅膜的TSEE的温度谱证明了几个峰:三个低温峰(T_1 = 373K,T_2 = 423K,T_3 = 498K)和T_4〜750K的高温最大值。所获得的能量激活值是φ_1= 0.82eV,φ_2= 0.93eV,φ+ 1.09eV,φ_4= 1.73eV。结果结果被证明与从微细闪烁的每个单元存储器晶体管测量获得的微闪光灯获得的φ估计一致。存储在陷阱处的电子φ_4= 1.73eV解释了优异的微卷潴留性能。我们认为,氮化硅中的深度陷阱是含氢中心,而氢气跳跃是在TSEE测量过程中观察到的材料降解的途径原因。

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