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Hole Drift-Mobility Measurements and Multiple-Trapping in Microcrystalline Silicon

机译:孔漂移 - 微晶硅中的迁移率测量和多捕获

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We present photocarrier time-of-flight measurements of the hole drift-mobility in microcrystalline silicon samples with a high crystalline volume fraction; typical room-temperature values are about 1 cm~2/Vs. Temperature-dependent measurements are consistent with the model of multiple-trapping in an exponential bandtail. While this model has often been applied to amorphous silicon, its success for predominantly crystalline samples is unexpected. The valence bandtail width is 31 meV, which is about 10-20 meV smaller than values reported for a-Si:H, and presumably reflects the greater order in the microcrystalline material. The hole band-mobility is about 1 cm~2/Vs-essentially the same magnitude as has been reported for electrons and for holes in amorphous silicon, and suggesting that this magnitude is a basic characteristic of mobility-edges, at least in silicon-based materials. The attempt-frequency v is about 10~9 s~(-1); this value is substantially smaller than the values 10~(11)-10~(12) s~(-1) typically reported for holes in amorphous silicon, but the physical significance of the parameter remains obscure.
机译:我们在微晶硅样品中呈现光载波的飞行时间测量,具有高结晶体积分数;典型的室温值约为1cm〜2 / Vs。温度依赖的测量与指数带尾部中的多捕获模型一致。虽然该模型经常应用于非晶硅,但其主要是晶体样品的成功意外。价带宽度为31meV,比对于A-Si:H的值小,约10-20meV,并且可能反映微晶材料中的较大顺序。孔带迁移率约为1cm〜2 /与基本上相同的幅度,如针对电子和非晶硅中的孔的报道,并且表明该幅度是移动性边缘的基本特征,至少在硅 - 基于材料。尝试频率v约为10〜9 s〜(-1);该值基本上小于10〜(11)-10〜(12)S〜(-1)的值,通常报告非晶硅中的孔,但参数的物理意义仍然模糊。

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