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Characterization of AlGaN/GaN Cantilevers Fabricated with Deep-Release Techniques

机译:深度释放技术制备的AlGaN / GaN悬臂的表征

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摘要

In this article, integrated AlGaN/GaN cantilevers on (111) silicon substrate are fabricated and characterized. The process started with AlGaN/GaN HEMTs fabrication followed by a series of dry-etch-only MEMS process. To characterize the residual stress distribution, Micro-Raman spectroscopy is used and the residual stress in suspended GaN cantilever is found ~ 90% lower after releasing. A type of micro-bending test is used to characterize the piezoresponse of AlGaN/GaN HEMT on the GaN cantilever. An output current modulation greater than 20% can be observed when the cantilever is vertically downward deflected ~ 30 μm.
机译:在本文中,制造并表征了在(111)硅基板上集成的AlGaN / GaN悬臂。该工艺始于AlGaN / GaN HEMT的制造,随后是一系列仅干法刻蚀的MEMS工艺。为了表征残余应力分布,使用了拉曼光谱,发现悬浮的GaN悬臂中的残余应力释放后降低了约90%。一种微弯曲测试用于表征GaN悬臂梁上的AlGaN / GaN HEMT的压电响应。当悬臂垂直向下偏转〜30μm时,可以观察到大于20%的输出电流调制。

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