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首页> 外文会议>International Conference of Chinese Society of Micro-Nano Technology;Annual Conference of the Chinese Society of Micro-Nano Technology >Fabrication and Performance Simulation of Microscale Thermoelectric Modules made with Bi_2Te_3-based Alloys
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Fabrication and Performance Simulation of Microscale Thermoelectric Modules made with Bi_2Te_3-based Alloys

机译：Bi_2Te_3基合金制成的微型热电模块的制备和性能模拟

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摘要

Micro or nano scale thermoelectric (TE) modules have received increasing attention because of their potential applications as energy supplying and thermal managing components in microelectronic devices and micro-electro-mechanical systems (MEMS). In the present work, microscale thermoelectric modules are fabricated by combining mechanical cutting and photolithograph processes from nano-sized silicon carbide (SiC) particles reinforced Bi_2Te_3-based materials (Bi_2Te_3 for n type, and Bi_(0.5)Sb_(1.5)Te_3 for p type) prepared by spark plasma sintering (SPS). The fabricated modules have 28 pairs of thermoelectric legs in an area of 3×3 mm~2, and each of them is 200×400 μm~2 in cross section and 600 μm in length, which is connected in series by Ni-Cu electrodes made with photolithograph patterning and magnetron sputtering. The thermoelectric performances of a p-n couple are simulated with the finite element method (FEM) under a thermal-electrical coupled multi-physics field for both electronic cooling (Peltier effect) and thermoelectric energy generation (Seebeck effect) working mold.
机译：微型或纳米级热电（TE）模块由于其作为微电子设备和微机电系统（MEMS）中的能量供应和热管理组件的潜在应用而受到越来越多的关注。在当前工作中，通过结合机械切割和光刻工艺，由纳米尺寸的碳化硅（SiC）颗粒增强的Bi_2Te_3基材料（n型为Bi_2Te_3，p型为Bi_（0.5）Sb_（1.5）Te_3）制成微尺度热电模块。型）通过火花等离子体烧结（SPS）制备。制作的模块具有3对3mm〜2的面积中的28对热电腿，每对的横截面为200×400μm〜2，长度为600μm，通过Ni-Cu电极串联连接用光刻图案和磁控溅射制成。在热电耦合多物理场下，通过有限元方法（FEM）对p-n偶的热电性能进行仿真，以用于电子冷却（珀尔帖效应）和热电能量生成（塞贝克效应）工作模具。

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