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A High Pressure Sensor with Circular Diaphragm Based on MEMS Technology

机译:基于MEMS技术的圆形膜片高压传感器。

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摘要

A pressure sensor in the range of 25 MPa with circular diaphragm is designed and fabricated, and the calibration experiments prove its excellent performance, which also reflects the correct choice of design after analyzing the effect of diaphragm dimension, location and shapes of piezoresistors. Circular diaphragms of different thickness and diameters are simulated to meet the pressure requirement of 25 MPa. It also displays the advantage of piezoresistive sensors over others and the difference characteristics between different types of piezoresistive sensors. And then the effect of piezoresistor location is analyzed and simulated to attain high accuracy and sensitivity after the circular diaphragm chip is packaged with borosilicate glass ring. The whole fabrication process of the chip is inexpensive and compatible with standard MEMS process. The experimental results show the developed high pressure sensor with the sensitivity of 2.533 mV/MPa has excellent performance, such as linearity of 0.08%FS, hysteresis of 0.03%FS, accuracy of 0.11%FS and repeatability of 0.03%FS under high temperature of 200 ℃.
机译:设计制造了圆形膜片压力为25 MPa的压力传感器,并通过校准实验证明了其优异的性能,在分析了膜片尺寸,压敏电阻的位置和形状的影响后,也反映出设计的正确选择。模拟了不同厚度和直径的圆形隔膜,以满足25 MPa的压力要求。它还显示了压阻传感器相对于其他传感器的优势以及不同类型的压阻传感器之间的差异特性。然后分析并模拟了压阻器位置对硼硅酸盐玻璃环封装圆膜片后的精度和灵敏度的影响。芯片的整个制造过程价格便宜,并且与标准MEMS工艺兼容。实验结果表明,所开发的灵敏度为2.533 mV / MPa的高压传感器具有良好的性能,例如在高温下的线性度为0.08%FS,磁滞为0.03%FS,精度为0.11%FS,重复性为0.03%FS。 200℃。

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