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首页> 外文会议>Annual Conference of the Chinese Society of Micro-Nano Technology >A High Pressure Sensor with Circular Diaphragm Based on MEMS Technology
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A High Pressure Sensor with Circular Diaphragm Based on MEMS Technology

机译：基于MEMS技术的圆形隔膜高压传感器

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摘要

A pressure sensor in the range of 25 MPa with circular diaphragm is designed and fabricated, and the calibration experiments prove its excellent performance, which also reflects the correct choice of design after analyzing the effect of diaphragm dimension, location and shapes of piezoresistors. Circular diaphragms of different thickness and diameters are simulated to meet the pressure requirement of 25 MPa. It also displays the advantage of piezoresistive sensors over others and the difference characteristics between different types of piezoresistive sensors. And then the effect of piezoresistor location is analyzed and simulated to attain high accuracy and sensitivity after the circular diaphragm chip is packaged with borosilicate glass ring. The whole fabrication process of the chip is inexpensive and compatible with standard MEMS process. The experimental results show the developed high pressure sensor with the sensitivity of 2.533 mV/MPa has excellent performance, such as linearity of 0.08%FS, hysteresis of 0.03%FS, accuracy of 0.11%FS and repeatability of 0.03%FS under high temperature of 200 °C.
机译：设计和制造圆形隔膜的25MPa范围内的压力传感器，校准实验证明了其优异的性能，这也反映了分析压电器尺寸，位置和形状的效果后的正确选择。模拟不同厚度和直径的圆形隔膜以满足25MPa的压力要求。它还显示出压阻传感器对其他传感器的优势以及不同类型的压阻传感器之间的差异特性。然后分析压阻器位置的效果并模拟以在用硼硅酸盐玻璃环包装圆形膜片芯片后获得高精度和灵敏度。芯片的整个制造过程廉价且与标准MEMS过程兼容。实验结果表明，发达的高压传感器具有2.533mV / MPa的灵敏度，具有优异的性能，如线性度为0.08％Fs，滞后0.03％Fs，精度为0.11％的Fs和0.03％Fs的0.11％Fs在高温下的重复性为0.03％Fs 200°C。

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