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THE FRACTURE TOUGHNESS OF POLYSILICON MICRODEVICES

机译：多晶硅微器件的断裂韧性

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摘要

The development of polysilicon fracture mechanics specimens with characteristic dimensions comparable to those of typical microelectromechanical systems (MEMS) devices is presented. The notched cantilever specimens are fully integrated with a simultaneously microfabricated electrostatic actuator, which allows on-chip testing of the specimens without the need of an external loading device, and without any possible influences from external sources. Under monotonic loading, the average maximum tensile stress (strength) and average nominal fracture toughness were measured as 4.2 GPa and 3.5 MPa-m~(1/2 for boron-doped specimens, and 5.0 GPa and 4.0 MPa-m~(1/2) for undoped specimens. An average modulus of rupture of 3.3 GPa and average nominal toughness of 2.7 MPa-m~(1/2) were measured for specimens cracked under cyclic resonance loading. The differences between the monotonic loading and cyclic loading data are attributed to fatigue initiation of a sharp crack from the 1 urn radius notch. The experimental data is consistent with a critical flaw size in the fabricated devices, a, that is related to the fracture toughness K_(Ic) by K_(Ic)/a~(1/2)=4600 MPa.
机译：介绍了具有与典型的微机电系统（MEMS）器件相当的特征尺寸的多晶硅断裂力学标本的开发。带缺口的悬臂样品完全与同时制造的静电致动器集成在一起，从而无需外部加载装置即可对样品进行片上测试，并且不受任何外部来源的影响。在单调加载下，平均最大拉伸应力（强度）和平均标称断裂韧性分别为4.2 GPa和3.5 MPa-m〜（对于掺硼样品为1/2，5.0 GPa和4.0 MPa-m〜（1 / 2）对于未掺杂的试样，在循环共振载荷下测得的试样的平均断裂模量为3.3 GPa，平均标称韧性为2.7 MPa-m〜（1/2），单调载荷与循环载荷数据之间的差异为归因于从1 radius半径刻痕处开始产生锐利裂纹的疲劳实验数据与制造的设备中的临界缺陷尺寸a相一致，这与断裂韧性K_（Ic）/ a有关〜（1/2）= 4600兆帕。

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  • 会议地点 San Francisco CA(US)
  • 作者

    R. BALLARINI; R.L. MULLEN; H. KAHN; A.H. HEUER;

  • 作者单位

    Civil Engineering Department, Case Western Reserve University, Cleveland, OH 44106-7201;

    Civil Engineering Department, Case Western Reserve University, Cleveland, OH 44106-7201;

    Materials Science and Engineering Department, Case Western Reserve University, Cleveland, OH 44106-7204;

    Materials Science and Engineering Department, Case Western Reserve University, Cleveland, OH 44106-7204;

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