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首页> 外文会议>Microelectronic Test Structures, 2009. ICMTS 2009 >Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film
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Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

机译：微机械测试结构在电镀坡莫合金膜应力测量中的应用

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摘要

Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.
机译：设计用于测量表面微机械加工薄膜中的应力的悬浮微旋转测试结构已应用于电镀坡莫合金（NiFe合金）厚层的生产。此过程对磁性MEMS组件和设备的生产特别重要。表征这种材料中的应力非常重要，尤其是在将这些膜用于带有底层集成电路的晶圆上时，因为众所周知，晶体管的匹配会受到在它们上方运行的互连部件引起的机械应变的影响。为了确定坡莫合金应力传感器结构的最佳尺寸，已经设计并制造了一种新的测试芯片。

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