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Wafer level inspection for determination of yield of surface-micromachined pressure sensors

机译：晶圆级检查以确定表面微机械压力传感器的合格率

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Abstract: Development of a surface micromachining process for commercial scale production of absolute pressure sensors necessitates the definition of inspection tests at each stage of the process and for the completed packaged product. The yield measurement described in this paper is for a Field Effect Transistor pressure sensor integrated into a CMOS process. This measurement can be divided into verification of the electrical and mechanical properties of the pressure device. This paper describes the development of a simple method for mechanical yield determination. The method is based on a visual inspection procedure where the interference rings observed under a conventional 5X/20X inspection microscope, are correlated with white light interferometry (wafer level and packaged devices) and Atomic Force Microscopy (AFM) (wafer level) measurements. The application of these two profiling methods is also compared in the paper. Based on this work a simple, low cost, automatic system for yield determination using standard equipment can be developed. Initial results from a software system for inspection automation are presented. !7
机译：摘要：开发用于商业规模生产绝对压力传感器的表面微加工工艺，需要在工艺的每个阶段以及完整的包装产品中定义检查测试。本文所述的成品率测量适用于集成到CMOS工艺中的场效应晶体管压力传感器。该测量可以分为压力装置的电气和机械性能验证。本文介绍了一种简单的机械产率测定方法的开发。该方法基于视觉检查程序，其中在常规5X / 20X检查显微镜下观察到的干涉环与白光干涉测量法（晶圆级和封装的设备）和原子力显微镜（AFM）（晶圆级）测量相关。本文还比较了这两种分析方法的应用。基于这项工作，可以开发一种简单，低成本，使用标准设备进行产量测定的自动系统。介绍了用于检查自动化的软件系统的初步结果。 ！7

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