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Encapsulated thermopile detector array for IR microspectrometer

机译：红外微光谱仪用封装热电堆探测器阵列

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摘要

The miniaturized IR spectrometer discussed in this paper is comprised of: slit, planar imaging diffraction grating and Thermo-Electric (TE) detector array, which is fabricated using CMOS compatible MEMS technology. The resolving power is maximized by spacing the TE elements at an as narrow as possible pitch, which is limited by processing constraints. The large aspect ratio of the TE elements implies a large cross-sectional area between adjacent elements within the array and results in a relatively large lateral heat exchange between micromachined elements by thermal diffusion. This thermal cross-talk is about 10% in case of a gap spacing of 10 μm between elements. Therefore, the detector array should be packaged (and operated) in vacuum in order to reduce the cross-talk due to the air conduction through the gap. Thin film packaging is a solution to achieve an operating air pressure atl.3 mBar, which reduces the cross-talk to 0.4%. An absorber based on an optical interference filter design is also designed and fabricated as an IC compatible post-process on top the detector array. The combination of the use of CMOS compatible materials and processing with high absorbance in 1.5 - 5 μm wavelength range makes a complete on-chip microspectrometer possible.
机译：本文讨论的微型红外光谱仪包括：狭缝，平面成像衍射光栅和热电（TE）检测器阵列，它们是使用CMOS兼容MEMS技术制成的。通过以尽可能窄的间距间隔放置TE元素，可以最大程度地提高分辨能力，这受制程限制。 TE元件的高纵横比意味着阵列内相邻元件之间的横截面积较大，并导致微加工元件之间通过热扩散进行较大的横向热交换。在元件之间的间隙间隔为10μm的情况下，这种热串扰约为10％。因此，检测器阵列应在真空中包装（和操作），以减少由于空气通过间隙而引起的串扰。薄膜包装是一种解决方案，可将工作空气压力降低至3 mBar，从而将串扰降低至0.4％。还设计和制造了基于光学干涉滤光片设计的吸收器，作为检测器阵列顶部的IC兼容后处理。结合使用兼容CMOS的材料和在1.5-5μm波长范围内具有高吸收率的处理，使得完整的片上显微光谱仪成为可能。

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