Devices and architectures for large scale integrated silicon photonics circuits

机译：大规模集成硅光子电路的设备和架构

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

We present DWDM nanophotonics architectures based on microring resonator modulators and detectors. We focus on two implementations: an on chip interconnect for multicore processor (Corona) and a high radix network switch (HyperX). Based on the requirements of these applications we discuss the key constraints on the photonic circuits' devices and fabrication techniques as well as strategies to improve their performance.

机译：我们介绍基于微环谐振器调制器和检测器的DWDM纳米光子学体系结构。我们专注于两种实现：用于多核处理器的片上互连（Corona）和高基数网络交换机（HyperX）。基于这些应用的需求，我们讨论了对光子电路器件和制造技术的关键约束，以及提高其性能的策略。

著录项

来源
《Optoelectronic integrated circuits XIII》|2011年|p.794204.1-794204.6|共6页
会议地点 San Francisco CA(US)
作者
Raymond G. Beausoleil; Andrei Faraon; David Fattal; Marco Fiorentino; Zhen Peng; Charles Santori;
展开▼
作者单位

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

HP Labs, 1501 Page Mill Rd., Palo Alto, CA, USA;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类光学集成电路（集成光路）;
关键词
silicon photonics; microring resonators; nanophotonics architectures;

机译：硅光子学微环谐振器；纳米光子学架构;

相似文献

外文文献
中文文献
专利

1. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices [J] . Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Applied Sciences . 2016,第12期

机译：光子封装：将硅光子集成电路转变为光子器件
2. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices [J] . Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Applied Sciences . 2016,第12期

机译：光子封装：将硅光子集成电路转变为光子器件
3. Monolithically Integrated Multilayer Silicon Nitride-on-Silicon Waveguide Platforms for 3-D Photonic Circuits and Devices [J] . Wesley D. Sacher, Jared C. Mikkelsen, Ying Huang, Proceedings of the IEEE . 2018,第12期

机译：用于3-D光子电路和器件的单片集成多层氮化硅硅波导平台
4. Devices and architectures for large scale integrated silicon photonics circuits [C] . Fiorentino M., Zhen Peng, Binkert N., 2011 IEEE Winter Topicals . 2011

机译：大规模集成硅光子电路的设备和架构
5. Silicon photonic devices for optoelectronic integrated circuits. [D] . Tien, Ming-Chun. 2009

机译：用于光电集成电路的硅光子器件。
6. III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range [O] . Ruijun Wang, Anton Vasiliev, Muhammad Muneeb, 2017

机译：III–V硅上光子集成电路用于2-4μm波长范围内的光谱传感
7. Photonic packaging: transforming silicon photonic integrated circuits into photonic devices [O] . 2016

机译：光子封装：将硅光子集成电路转变为光子器件

Devices and architectures for large scale integrated silicon photonics circuits

摘要

著录项

相似文献

相关主题

期刊订阅