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Investigation of the influence of unwanted micro lenses caused by semiconductor processing excursions on optical behavior of CMOS photodiodes

机译:半导体工艺偏移引起的不必要的微透镜对CMOS光电二极管光学性能的影响的研究

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In this work the influence of nanoscale particles caused by processing excursions during back end of line (BEOL) processing on top of the photodiode active region was examined. To investigate the influence of the particles on the photodiode performance, wafer level optical responsivity measurements were done. In addition to the measurements the effect of the particles was simulated with a simplified model based on a modified transfer matrix method (MTMM). The simulation and measurements are in very good agreement with each other and lead to the conclusion that even though some decrease of sensitivity was observed, the overall system variability was reduced by the presence of particles. Furthermore, the influence of the dielectric stack layer thickness variability on the photon flux density is reduced.
机译:在这项工作中,研究了由线后端(BEOL)处理在光电二极管有源区顶部上的处理偏移引起的纳米级颗粒的影响。为了研究颗粒对光电二极管性能的影响,进行了晶圆级光响应度测量。除了测量之外,还使用基于改进的传递矩阵方法(MTMM)的简化模型来模拟粒子的效果。仿真和测量结果彼此非常吻合,得出的结论是,即使观察到灵敏度有所降低,但由于颗粒的存在,降低了整个系统的可变性。此外,减小了电介质堆叠层厚度可变性对光子通量密度的影响。

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