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Rapid Characterization of Surfaces with Thin Films Using Mercury Probe Electrical Testing

机译:使用汞探针电测试快速表征薄膜表面

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As the semiconductor industry continues to implement the ITRS node targets that go beyond 45nm, the presence of films on substrates to be patterned, must be well characterized. Applying films as coatings, metal protection, or in cases of their removal, a rapid test for process control, that is sensitive and non-destructive, is needed. One such screening method includes the use of a mercury probe analyzer. Metal passivation may is detected by elevated resistance for a inhibitor mix relative to benzotriazole (BTA) and tolytriazole (TTA) observed on copper. Demonstration has also occurred in the nanofabrication of magnetic structures where a polymer film is applied to metal plated disks and further processed. In this case, the probe is used to detect the presence or absence of < 20nm of ashed polymer. Substrates cleaned with a metal-safe aqueous cleaner, show resistance values similar to the reference metal substrate. Evaluation is conducted using a coaxial Hg dot and ring contact supported by an MDC computerized measurement system with an engineering Ⅰ-Ⅴ plotting program. Also presented is the use of the mercury probe as a screening tool to verify removal of thick acrylic negative-tone resists.
机译:随着半导体行业继续实现超过45nm的ITRS节点目标,必须很好地表征要图案化的基板上存在的薄膜。需要将薄膜用作涂层,金属保护层,或者在去除薄膜的情况下,需要对过程控制进行快速,灵敏且无损的测试。一种这样的筛选方法包括使用汞探针分析仪。通过在铜上观察到的相对于苯并三唑(BTA)和甲苯三唑(TTA)的抑制剂混合物的电阻升高,可以检测到金属钝化。在磁性结构的纳米加工中也已进行了演示,在该工艺中,将聚合物膜施加到镀金属的磁盘上并进行了进一步处理。在这种情况下,该探针用于检测灰烬聚合物是否小于20nm。用金属安全的水性清洁剂清洁的基材的电阻值与参考金属基材相似。使用由MDC计算机测量系统支持的同轴汞点和环触点进行评估,并使用工程Ⅰ-Ⅴ绘图程序。还介绍了使用水银探针作为筛选工具来验证去除厚丙烯酸负型抗蚀剂的方法。

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