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Radiation Damages in CMOS Image Sensors:Testing and Hardening Challenges Brought by Deep Sub-Micrometer CIS Processes

机译:CMOS图像传感器中的辐射损伤:深亚微米CIS工艺带来的测试和硬化挑战

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This paper presents a summary of the main results we observed after several years of study on irradiated custom imagers manufactured using 0.18 μm CMOS processes dedicated to imaging. These results are compared to irradiated commercial sensor test results provided by the Jet Propulsion Laboratory to enlighten the differences between standard and pinned photodiode behaviors. Several types of energetic particles have been used (gamma rays, X-rays, protons and neutrons) to irradiate the studied devices. Both total ionizing dose (TID) and displacement damage effects are reported. The most sensitive parameter is still the dark current but some quantum efficiency and MOSFET characteristics changes were also observed at higher dose than those of interest for space applications. In all these degradations, the trench isolations play an important role. The consequences on radiation testing for space applications and radiation-hardening-by-design techniques are also discussed.
机译:本文总结了我们对使用专用于成像的0.18μmCMOS工艺制造的辐照定制成像仪进行了数年研究后观察到的主要结果的摘要。将这些结果与喷气推进实验室提供的辐照商业传感器测试结果进行比较,以阐明标准光电二极管和固定光电二极管行为之间的差异。已经使用了几种类型的高能粒子(伽马射线,X射线,质子和中子)来照射所研究的装置。报告了总电离剂量(TID)和位移损伤效应。最敏感的参数仍然是暗电流,但是在高于太空应用中所需剂量的情况下,也观察到了一些量子效率和MOSFET特性的变化。在所有这些退化中,沟槽隔离起着重要作用。还讨论了空间应用辐射测试和按设计辐射硬化技术的后果。

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