RESIDUAL STRESS CHARACTERIZATION OF THICK PECVD TEOS FILMFOR POWER MEMS APPLICATIONS

机译：厚PECVD TEOS膜的残余应力表征 r n在功率MEMS中的应用

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This paper reports residual stress characterization of thickrnoxide films. Engineering approaches for creating lo-20μm oxidernfilms without cracking and wafer bow were demonstrated.

机译：本文报道了厚氧化膜的残余应力特征。演示了创建低至20μm氧化膜而不会破裂和晶圆弯曲的工程方法。

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来源
《Solid-state sensor and actuator workshop : Technical digest》|2000年|p.316-319|共4页
会议地点 Hilton Head Island SC(US)
作者
X. Zhang; R. Ghodssitt; K-S Chenttt; A. A. Ayont; S. M. Spearing;
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作者单位

Massachusetts Institute of Technology, Cambridge, MA 02139;

Uiversity of Maryland, College Park, MD 20742;

National Cheng-Kung University, Taiwan 701, Taiwan;

Massachusetts Institute of Technology, Cambridge, MA 02139;

Massachusetts Institute of Technology, Cambridge, MA 02139;

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原文格式 PDF
正文语种 eng
中图分类 TM938.865;
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1. Residual stress and fracture in thick tetraethylorthosilicate (TEOS) and silane-based PECVD oxide films [J] . X. Zhang, K. -S. Chen, R. Ghodssi, Sensors and Actuators, A. Physical . 2001,第3期

机译：厚的原硅酸四乙酯（TEOS）和基于硅烷的PECVD氧化膜中的残余应力和断裂
2. Thick and low-stress PECVD amorphous silicon for MEMS applications [J] . Iliescu C, Chen BT Journal of Micromechanics and Microengineering . 2008,第1期

机译：适用于MEMS应用的厚而低应力PECVD非晶硅
3. Thick and low-stress PECVD amorphous silicon for MEMS applications [J] . Ciprian Iliescu, Bangtao Chen Journal of Micromechanics and Microengineering . 2008,第1期

机译：适用于MEMS应用的厚而低应力PECVD非晶硅
4. Residual stress characterization of thick PECVD TEOS film for power MEMS applications [C] . X. Zhang, R. Ghodssi, K. -S. Chen, Solid-State Sensor and Actuator Workshop . 2000

机译：电力MEMS应用厚PECVD TEOS膜的残余应力特征
5. The Influence of Clamping and Residual Stress on Scaling Effects in Pb(Zr0.3Ti0.7)O3 Thin Films for Piezomems Applications [D] . Denis, Lyndsey M. . 2019

机译：压电瘤应用Pb（Zr0.3Ti0.7）O3薄膜对缩放效应对缩放效应的影响
6. Data relating to mems piezoelectric micro power harvester physical parameter optimization for extremely low frequency and low vibration level applications [O] . Mohd H.S. Alrashdan 2020

机译：关于MEMS压电微功率HARVESTER物理参数优化的数据用于极低频率和低振动级应用
7. Characterization of UHV E-beam Evaporated Low-Stress Thick Silicon Film for MEMS Application [O] . Michael A., Kazuo O., Xu Y.W., 2012

机译：用于MEMS的超高压电子束蒸发低应力厚硅膜的表征
8. Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices [R] . Zhang, X. 2007

机译：功率mEms结构和器件用pECVD厚氧化膜的残余应力和断裂

RESIDUAL STRESS CHARACTERIZATION OF THICK PECVD TEOS FILMFOR POWER MEMS APPLICATIONS

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