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Electron beam excited plasma cvd for silicon growth

机译:电子束激发等离子体CVD用于硅生长

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Electron beam excited plasma (EBEP) CVD is a novel fabrication route for poly Si. Deposition was carried out on Si and SiO_2 layer from pure SiH_4 without hydrogen dilution. Crystalline silicon (#mu#c-Si:H) films were made with electron acceleration voltage, discharge current, source gas flow rate, chamber presser, substrate temperature varied systematically. Average grain size was about 10 nm. Crystalline ratio was up to 0.7 at the maximum. The films contain about 19 atpercent hydrogen in spite of no dilution. It is considered that EBEP supplies much about atomic hydrogen due to the high decomposability of the source gas.
机译:电子束激发等离子体(EBEP)CVD是多晶硅的一种新颖制造方法。在没有氢气稀释的情况下,从纯SiH_4在Si和SiO_2层上沉积。通过电子加速电压,放电电流,原料气体流速,腔室压力,衬底温度的系统变化来制备结晶硅(#mu#c-Si:H)薄膜。平均晶粒尺寸为约10nm。结晶率最大为0.7。尽管没有稀释,该膜仍含有约19%的氢。由于原料气体的高分解性,人们认为EBEP提供的氢原子很多。

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