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首页> 外文学位 >Fluidic-driven cooling of electronic hardware. Part I: Channel integrated vibrating reed. Part II: Active heat sink.
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Fluidic-driven cooling of electronic hardware. Part I: Channel integrated vibrating reed. Part II: Active heat sink.

机译：电子硬件的流体驱动冷却。第一部分：通道集成振动簧片。第二部分：有源散热器。

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摘要

Enhanced heat transfer in electronic hardware by direct, small-scale actuation is investigated experimentally in two test bed configurations. In Part I of this work, a method for cooling compact electronics that exploits the unsteady motions induced by a vibrating reed embedded within a heated duct (in contact with hardware that needs cooling) to enhance forced convection transport heat from the duct surfaces is introduced. The time-harmonic oscillations of the PiezoElectric Reed (PER) induce a reverse Karman vortex street through the channel, introducing small scale motions throughout the length of the duct. The flow characteristics of this device are investigated with PIV for various reed operating conditions, including placing two reeds in tandem and in parallel. The effect of altering the channel configuration is also determined. For high heat flux applications, an externally induced bulk flow can be augmented by the small scale motions induced by the reed.;The small scale motions enhance the heat transfer over that of conventional time invariant flows at similar or higher Reynolds numbers. The vibrating reed helps to disrupt the thermal boundary layer as well as fully mix the heated fluid near the wall with the cooler core flow. In both the presence or absence of an externally induced core flow, streamwise distributions of local Nusselt number indicate that the heat transfer can increased by a factor of two.;In Part II of this work, the effect of small scale motions induced by a synthetic jet on heat transfer within an advanced heat sink is investigated. The synthetic jet module is optimized and several flow configurations are tested. The optimal design directs the synthetic jets to emanate directly through the base of the heat sink and induce a recirculating flow between the fins. This results in a lower thermal resistance than what is typically achieved with traditional fans at the same flow rate.
机译：在两个测试台配置中，通过直接的小规模驱动来增强电子硬件中的传热效果。在这项工作的第一部分中，介绍了一种用于冷却紧凑型电子设备的方法，该方法利用嵌入在加热管道（与需要冷却的硬件接触）中的振动簧片引起的不稳定运动，以增强来自管道表面的强制对流传输热。压电簧片（PER）的时谐振荡引起一条反向的卡曼涡旋街通过该通道，从而在整个管道长度范围内引入了小规模的运动。用PIV在各种簧片操作条件下研究了该装置的流动特性，包括串联和并联放置两个簧片。还确定了更改通道配置的效果。对于高热通量的应用，通过簧片引起的小尺度运动可以增加外部感应的整体流量。小尺度的运动比常规时不变流以相似或更高的雷诺数提高了热传递。振动的簧片有助于破坏热边界层，并使壁附近的加热流体与冷却器芯流充分混合。无论是否存在外部诱导的岩心流，局部努塞尔数的沿流方向分布都表明热传递可以增加两倍。；在这项工作的第二部分中，由合成引起的小规模运动的影响研究了先进散热器内传热的射流。优化了合成射流模块并测试了几种流量配置。最佳设计可引导合成射流直接通过散热器的底部散发出来，并在散热片之间产生再循环流。与在相同流量下传统风扇通常获得的热阻相比，这导致了较低的热阻。

著录项

  • 作者

    Gerty, Donavon.;

  • 作者单位

    Georgia Institute of Technology.;

  • 授予单位 Georgia Institute of Technology.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 184 p.
  • 总页数 184
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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