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Microelectromechanical (MEMS) VLSI structures for hearing instruments.

机译:用于助听器的微机电(MEMS)VLSI结构。

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摘要

In this thesis two microelectromechanical (MEMS) structures have been designed for use in a hearing instrument. MEMS realization of a capacitive microphone has been designed that has a higher sensitivity in mV/Pa than the sensitivity of the existing MEMS microphones together with an extended audio frequency response range. The microphone is designed using a low residual stress polysilicon germanium diaphragm of thickness 0.8 mum and an area of 2.5 x 2.5 mm2, an airgap of thickness 3.0 mum and a silicon nitride backplate of thickness 1.0 mum with 1280 acoustical ports. Each acoustical port has a dimension of 30 x 30 mum2. The microphone is constructed using a combination of surface and bulk micromachining techniques in a single wafer process to achieve a sensitivity of 52 mV/Pa and a frequency response extending up to 18 kHz. The electromechanical analysis of the microphone structure is carried out using IntelliSuite MEMS software with an accuracy of convergence of 0.005 mum. (Abstract shortened by UMI.)
机译:在本文中,设计了两种微机电(MEMS)结构用于助听器。 MEMS电容式麦克风的实现已被设计为具有比现有MEMS麦克风更高的mV / Pa灵敏度,并具有扩展的音频响应范围。麦克风采用厚度为0.8μm,面积为2.5 x 2.5 mm2的低残留应力多晶硅锗膜片,厚度为3.0μm的气隙和厚度为1.0μm的氮化硅背板(带有1280个声学端口)进行设计。每个声学端口的尺寸为30 x 30 mum2。该传声器是在单晶片工艺中结合使用表面和整体微机械加工技术而制成的,以实现52 mV / Pa的灵敏度和高达18 kHz的频率响应。麦克风结构的机电分析是使用IntelliSuite MEMS软件进行的,收敛精度为0.005微米。 (摘要由UMI缩短。)

著录项

  • 作者

    Chowdhury, Sazzadur.;

  • 作者单位

    University of Windsor (Canada).;

  • 授予单位 University of Windsor (Canada).;
  • 学科 Health Sciences Audiology.;Engineering Electronics and Electrical.
  • 学位 M.A.Sc.
  • 年度 2000
  • 页码 158 p.
  • 总页数 158
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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