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Electromagnetic modeling of interconnections in three-dimensional integration.

机译：三维集成中互连的电磁建模。

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摘要

As the convergence of multiple functions in a single electronic device drives current electronic trends, the need for increasing integration density is becoming more emphasized than in the past. To keep up with the industrial need and realize the new system integration law, three-dimensional (3-D) integration called System-on-Package (SoP) is becoming necessary. However, the commercialization of 3-D integration should overcome several technical barriers, one of which is the difficulty for the electrical design of interconnections. The 3-D interconnection design is difficult because of the modeling challenge of electrical coupling from the complicated structures of a large number of interconnections. In addition, mixed-signal design requires broadband modeling, which covers a large frequency spectrum for integrated microsystems. By using currently available methods, the electrical modeling of 3-D interconnections can be a very challenging task.;This dissertation proposes a new method for constructing a broadband model of a large number of 3-D interconnections. The basic idea to address the many interconnections is using modal basis functions that capture electrical effects in interconnections. Since the use of global modal basis functions alleviates the need for discretization process of the interconnection structure, the computational cost is reduced considerably. The resultant interconnection model is a RLGC model that describes the broadband electrical behavior including losses and couplings. The smaller number of basis functions makes the interconnection model simpler, and therefore allows the generation of network parameters at reduced computational cost. Focusing on the modeling of bonding wires in stacked ICs and through-silicon via (TSV) interconnections, this research validates the interconnection modeling approach using several examples from 3-D full-wave EM simulation results.
机译：随着单个电子设备中多种功能的融合推动当前的电子趋势，与过去相比，越来越需要提高集成密度。为了满足工业需求并实现新的系统集成法则，称为包装上系统（SoP）的三维（3-D）集成已成为必要。但是，3D集成的商业化应克服几个技术障碍，其中之一是互连的电气设计困难。由于来自大量互连的复杂结构的电耦合建模挑战，因此3-D互连设计非常困难。此外，混合信号设计需要宽带建模，该宽带建模涵盖了集成微系统的大频谱。利用目前可用的方法，对3-D互连的电学建模可能是一项非常具有挑战性的任务。本文提出了一种构建大量3-D互连的宽带模型的新方法。解决许多互连问题的基本思想是使用模态基本函数来捕获互连中的电效应。由于全局模态基函数的使用减轻了互连结构离散化过程的需要，因此大大降低了计算成本。最终的互连模型是RLGC模型，该模型描述了包括损耗和耦合在内的宽带电气行为。基本函数的数量越少，互连模型就越简单，因此可以以降低的计算成本生成网络参数。着眼于堆叠式IC和硅通孔（TSV）互连中的键合线建模，本研究使用来自3-D全波EM仿真结果的几个示例验证了互连建模方法。

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  • 作者

    Han, Ki Jin.;

  • 作者单位

    Georgia Institute of Technology.;

  • 授予单位 Georgia Institute of Technology.;
  • 学科 Engineering Electronics and Electrical.;Physics Electricity and Magnetism.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 167 p.
  • 总页数 167
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;电磁学、电动力学;
  • 关键词

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