In the traditional process,the dry-film is photoetched after it is sticked on the surface of the workpiece,but it can not be used repeatly. A new technological process of the dry-film is put forward,which the photoetching is proceeded with the dry-film before it pasting. Based on this process , the properties of exposure and development are studied. Optimizing the parameters ,the micro through-hole array with diameter 99.7 μm is well generated in the dry-film ,and it is successfully employed in the through-mask electrochemical micromachining. Selecting reasonable parameters ,the micro-dimple array with diameter 125 μm and 10 μm deepth is well prepared on the workpiece. The dry-film is liable to separate from the workpiece and is used repeatly ,thus its utilization is higher.%在传统工艺流程中，必须先将干膜贴于工件表面，然后进行光刻，但干膜不可重复使用。现提出一种新型干膜光刻工艺流程，在干膜贴于工件表面之前，先对干膜单独进行光刻试验研究。基于该新型工艺流程，研究了杜邦干膜GPM220的曝光及显影特性。经过对曝光量（曝光时间）及显影时间的参数优化，最终在干膜上获得了平均直径为99.7μm的通孔阵列，并将其作为掩膜应用于微细电解加工，通过选择合理的加工参数，在工件表面获得了平均直径为125μm、平均深度为10μm的微坑阵列。电解实验后的干膜易与工件分离，可实现重复使用，提高了干膜的利用率。
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