3D-TSV package technology is the best impactful technique approach to achieve three dimension system package with multifunction, high-performance, high-reliability, more light weight, thinner, smaller. The paper presented several key technologies of 3D-TSV package, such as, via fabrication, iflm deposition on via sidewall, via filling, copper CMP, ultra-thin wafer grinding, chip/wafer stacking bonding. And discussed techno-theory, techno-characteristic, application area, development status of key technologies, the key equipments, the key materials, and application of 3D-TSV package technology.%3D-TSV封装技术是实现多功能、高性能、高可靠且更轻、更薄、更小的系统级封装最有效的技术途径之一。3D-TSV封装关键技术包括：通孔制作、通孔薄膜淀积、磁控溅射、通孔填充、铜化学机械研磨、超薄晶圆减薄、芯片/晶圆叠层键合等。阐述了每种关键技术的工艺原理、技术特点、应用范围及发展前景，关键设备、关键材料以及TSV在三维封装技术中的应用。
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