As Integrated Circuit (IC) industry changes rapidly, introducing smaller design rules with shorter life cycles, a new product will be introduced to mass production fabs in a short period of time. In order to rapidly ramp up a new process, in-line defect review and classification is required, since it can provide faster root cause analysis, thus improved yield and fab productivity. Traditionally, it takes approximately one month to optimize an in-line ADR/ADC (Automatic Defect Review/Classification) recipe for a new product. However, this is not sufficient for rapid industrial changes. This study, introduces a time saving idea by the use of a modular recipe concept. This concept enables review of similar layers across multiple products-without the need to re-tune the ADR/ADC recipe elements. Using this method, PSC Fab12A could implement a new in-line ADR/ADC recipe for 0.13 μm products, based on 0.15 μm defect database,within two hours.%随着集成电路工业的快速成长,需在短时间内,引进愈小组件设计且导入量产的时间,愈来愈短.为了新产品能尽早导入量产,产品的缺陷的再检查(review)与分类是必要的,以期提供快速缺陷原因分析,改善良率与生产.在传统的做法中,建立新产品的二次电子显微镜的自动缺陷再检查/自动缺陷分类(SEM ADR/ADC)最佳化程序,需时至少1个月,以收集足够的二次电子影像数据库,但是,这已经无法符合集成电路工业产品快速转换的需求,提出一种省时间的(模块程序概念).这概念使不同产品的相似组成/结构层(layer),不需要额外的二次电子显微镜的自动缺陷再检查/自动缺陷分类(SEM ADR/ADC)程序建立时间,利用此方法,台湾力晶半导体φ300 mm晶圆厂利用0.15μm的缺陷数据库,成功地在2小时内建立新的0.13 μm产品线上二次电子显微镜的自动缺陷再检查/自动缺陷分类(SEM ADR/ADC)程序,加速缺陷原因分析与良率提升.
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