To reduce the DPMO of electronic modules' assembly drawing from 630 000 to 126 000, at least 80% of reduction, the definition, measurement, analysis, improvement and control process of Six Sigma was employed to perform the causal analysis and mechanism analysis for the design quality of electronic modules' assembly drawing. In the fact, the DPMO was reduced to 57 000, better than 91% of the original data. It was obtained through measurement and analysis on FTY of electronic module's assembly drawing after process improvement. It proves that the process improvement method is feasible and its effect is desired. It has a certain practical value.%为了将电子模块装焊图DPMO由630000降低到126000,改善至少80％的目的；采用六西格玛思想的“定义、测量、分析、改善与控制”流程方法对电子模块装焊图的设计质量进行因果分析和机理分析.对流程改善结果数据进行测量分析,得出最终将DPMO降低至57000,实际改善91％.结果证明,该流程改善方法可行,流程改善输出成果达到了预期的效果,具有一定的工程实用价值.
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