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首页> 美国卫生研究院文献>Micromachines >On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

机译：采用喷墨印刷重新分布层对电容式微机械超声换能器（CMUT）的扇出晶圆级包装的可行性

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摘要

Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler vibrometry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.
机译：扇出晶圆级包装（Fowlp）是用于微机电系统（MEMS）传感器包装的有趣平台。使用FOWLP用于MEMS传感器包装具有一些独特的挑战，而一些源自仅来自再分配层（RDL）的制造。例如，在RDL形成期间保护精细结构和脆弱的膜是至关重要的。因此，对于RDL形成的添加剂制造（AM）似乎是一种吉祥的方法，因为这些挑战被原则征服。在这项研究中，通过利用AM的益处，通过触控式喷墨印刷技术实现了电容式微机械超声传感器（CMUT）的扇出包装的RDL。通过温度循环试验评估印刷轨道的长期可靠性。鉴定了多层和实施绝缘斜坡对导电轨道可靠性的影响。通过激光多普勒振动器（LDV）测量和相应的谐振频率进一步研究CCUT模具上的包装诱导的应力。结论，详细讨论了用于家禽印刷RDL的瓶颈。

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