首页> 外文期刊>Advancing Microelectronics >Rudolph's NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection
【24h】

Rudolph's NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

机译:鲁道夫的NovusEdge被领先的晶圆制造商选择用于裸晶圆边缘和背面检查

获取原文
获取原文并翻译 | 示例
           

摘要

Wilmington, Mass. (12/11/2018)-Rudolph Technologies, Inc. announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside inspection on bare silicon wafers. The new orders are for capacity expansions at our existing customers as well as orders from two additional large wafer manufacturers based in Asia. These orders are in addition to the $3M previously announced and will ship throughout calendar year 2019.
机译:马萨诸塞州威明顿市(12/11/2018)-鲁道夫技术公司(Rudolph Technologies,Inc.)宣布,其最新发布的NovusEdge™系统用于裸硅晶圆的边缘和背面检查,已收到超过1200万美元的新订单。新订单是为了扩大现有客户的产能,以及来自亚洲另外两家大型晶圆制造商的订单。这些订单是先前宣布的300万美元的补充,并将在整个2019日历年内发货。

著录项

  • 来源
    《Advancing Microelectronics》 |2019年第1期|20-20|共1页
  • 作者

  • 作者单位
  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号