Rudolph Ships 100th Wafer Edge and Backside Inspection System

Rosalinda M. Ring

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Rudolph Ships 100th Wafer Edge and Backside Inspection System

机译：鲁道夫（Rudolph）交付第100个晶圆边缘和背面检测系统

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Rudolph Technologies, Inc. (Flanders, N.J.), a worldwide leader in high-performance process characterization systems for the semiconductor manufacturing industry, announced that it has shipped 100 of its edge and backside automated macro defect inspection tools to chipmakers around the world. The edge and backside of the wafer, which are primary sources of defectivity, are areas where manufacturers can realize maximum returns from their investment in inspection and control technology.

机译：半导体制造行业高性能工艺表征系统的全球领导者Rudolph Technologies，Inc.（新泽西州弗兰德斯）宣布已向全球芯片制造商交付了100种其边缘和背面自动宏缺陷检测工具。晶圆的边缘和背面是缺陷的主要来源，在这些区域，制造商可以从对检测和控制技术的投资中获得最大的回报。

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《Electronic Device Failure Analysis: A Resource for Technical Information and Industry Developments》 |2008年第1期|共1页
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Rosalinda M. Ring;
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1. Rudolph Ships 100th Wafer Edge and Backside Inspection System [J] . Rosalinda M. Ring Electronic Device Failure Analysis: A Resource for Technical Information and Industry Developments . 2008,第1期

机译：鲁道夫（Rudolph）交付第100个晶圆边缘和背面检测系统
2. Rudolph's NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection [J] . Advancing Microelectronics . 2019,第1期

机译：鲁道夫的NovusEdge被领先的晶圆制造商选择用于裸晶圆边缘和背面检查
3. Cutting-Edge Inspection Systems Cater to Advanced Wafer Process [J] . Asia electronics industry . 2016,第9期

机译：先进的检测系统可满足先进的晶圆工艺
4. Use of Wafer Backside Inspection and SPR to Address Systemic Tool and Process Issues [C] . Alan Carlson, Prasad Bachiraju, Jennifer Clark, Conference on metrology, inspection, and process control for microlithography XXIV . 2010

机译：使用晶圆背面检查和SPR解决系统性工具和流程问题
5. Ship design using the ship smart system design tool: An evaluation of the tools and methods necessary to facilitate the design of modern ships with complex interdependent systems. [D] . Kuhn, Kevin X. 2015

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6. Laser Processing of Transparent Wafers with a AlGaN/GaN Heterostructures and High-Electron Mobility Devices on a Backside [O] . Simonas Indrišiūnas, Evaldas Svirplys, Justinas Jorudas, 2021

机译：用AlGaN / GaN异质结构和背面的高电子移动装置激光加工透明晶片
7. Correlation of Wafer Backside Defects to Photolithography Hot Spots Using Advanced Macro Inspection [O] . Alan Carlson A, Tuan Le A 2006

机译：利用先进的宏观检测技术研究晶圆背面缺陷与光刻热点的关系

Rudolph Ships 100th Wafer Edge and Backside Inspection System

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