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首页> 外文期刊>American journal of applied sciences >A Novel Technique to Perform Plating on Printed Circuit Board
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A Novel Technique to Perform Plating on Printed Circuit Board

机译：在印刷电路板上执行电镀的新技术

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Problem statement: This research attempts to optimize the parameters for pulse plating of silver on printed circuit board. The idea here is to use pulse plating technique which is metal deposition by pulsed electrolysis method. Approach: Printed Circuit Boards (PCB) plays a major role in all communication and electronics industry. Silver is a ductile and malleable metal which has 7% higher conductivity than copper. Here the electro deposit is influenced by current density, silver concentration in the bath, applied current type. Pulse plating technique is used in double sided printed circuit board especially in the case of plated through hole technique. Here exist a necessity to do plating which will deposit a metal wall in the substrate and it will connect between the components. Results: This method of pulse plating proves that it avoids the disadvantage of rough deposition that is caused due to DC plating in PCB's. Conclusion: The surface morphology and the grain size is measured using XRD analysis and it proves that the number of pin holes is reduced.
机译：问题陈述：这项研究试图优化用于在印刷电路板上脉冲镀银的参数。这里的想法是使用脉冲电镀技术，该技术是通过脉冲电解方法进行的金属沉积。方法：印刷电路板（PCB）在所有通信和电子行业中都扮演着重要角色。银是一种易延展和可延展的金属，其导电率比铜高7％。在这里，电沉积受电流密度，熔池中银浓度和施加电流类型的影响。脉冲电镀技术用于双面印刷电路板中，尤其是在电镀通孔技术中。这里有必要进行电镀，该电镀将在基板上沉积金属壁，并且它将在组件之间连接。结果：这种脉冲电镀方法证明，它避免了由于PCB中的DC电镀引起的粗糙沉积的缺点。结论：利用X射线衍射仪对表面形貌和晶粒尺寸进行了测量，结果表明针孔数量减少了。

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