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High temperature nitrogen annealing induced interstitial oxygen precipitation in silicon epitaxial layer on heavily arsenic-doped silicon wafer

机译:高温氮退火在重掺杂砷的硅晶片上的硅外延层中引起间隙氧沉淀

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摘要

High temperature nitrogen annealing induced interstitial oxygen (O_i) precipitation has been investigated in silicon epitaxial layers (epilayers) grown on heavily arsenic-doped Czochralski silicon wafers. Both transmission electron microscopy and secondary ion mass spectrometry data indicate a strong O_i precipitation and/or segregation in the subsurface of epilayers annealed in N_2 at 1200℃. The O_i precipitates have needlelike morphology with {111} habit planes along < 110 > directions. This precipitation is facilitated by thermal nitridation-produced vacancies or nitrogen-vacancy complexes and is sensitive to annealing conditions. Annealing in Ar or in N_2 at temperature < 1125℃ results in no epilayer subsurface O_i precipitation.
机译:已经研究了在高砷掺杂的直拉硅片上生长的硅外延层(外延层)中高温氮退火引起的间隙氧(O_i)沉淀。透射电子显微镜和二次离子质谱数据均表明在1200℃的N_2中退火的表层亚表面有很强的O_i析出和/或偏析。 O_i沉淀物呈针状形态,沿<110>方向具有{111}惯性平面。热氮化产生的空位或氮空位络合物促进了这种沉淀,并且对退火条件敏感。在<1125℃的温度下在Ar或N_2中进行退火不会导致外延层表面O_i析出。

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