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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process
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Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process

机译：玻璃水平模具固化过程中扇出晶圆级包装的粘弹性翘曲建模

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摘要

This article aims to characterize the warpage evolution of fan-out wafer-level packaging (FOWLP) during the wafer-level mold cure process. A finite-element analysis (FEA)-based process modeling framework, which includes the effects of geometric nonlinearity, gravity, and the cure-dependent chemical shrinkage of epoxy molding compound (MC), is presented to determine the warpage behavior of the molded wafer at different process steps. Focus is placed on the effect of the viscoelastic behavior of the epoxy MC on the process-induced warpage, where its linear viscoelastic properties are characterized using dynamic mechanical analysis in a frequency domain at different temperatures based on the thermorheological simplicity. In addition, its temperature-dependent thermal-mechanical properties and cure state are investigated through experiments. The simulation results are validated by the in-line warpage measurement data. The alternative emphasis is to explore the effects of thermal annealing and wafer thinning on the warpage. To fabricate thin molded wafer at better handing, an indirect two-step process is proposed. The process-induced warpage resulting from the two-step process is investigated and compared against that of the direct one-step process. Besides, the dependences of the process-induced warpage on the material properties of the epoxy MC and support carrier are examined through parametric analysis.
机译：本文旨在在晶圆级模具固化过程中表征扇出晶片级包装（Fowlp）的翘曲演变。基于有限元分析（FEA）的过程建模框架，包括几何非线性，重力和环氧模塑化合物（MC）的固化依赖性化学收缩的效果，以确定模制晶片的翘曲行为在不同的过程步骤。将焦点置于环氧MC对过程诱导的翘曲上的粘弹性行为的影响，其中其线性粘弹性特征在于在不同温度下的频域中的动态机械分析，基于热流学简单。此外，通过实验研究其温度依赖性热机械性能和固化状态。仿真结果由在线翘曲测量数据验证。替代强调是探讨热退火和晶片稀疏在翘曲上的影响。为了在更好的情况下制造薄模制晶片，提出了间接的两步工艺。研究了由两步过程产生的过程引起的翘曲，并与直接一步法进行比较。此外，通过参数分析检查过程诱导的翘曲对环氧MC和支撑载体的材料特性的依赖性。

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